Neenah News

Neenah will showcase its premium packaging products and custom solutions in London


NEENAH Packaging will showcase its premium packaging products and custom capabilities at this year’s Packaging Innovations & Luxury Packaging show (F75) at Olympia, London, September 13-14, 2017.



Introducing a new page-turning promotional lookbook from The Design Collection


A new page-turning promotional lookbook of unique surface design treatments — including arresting images, unconventional diecuts, spectacular printing and specialty techniques — has just been released by Neenah. The book is crafted on papers from The Design Collection, Neenah’s range of pearlized surfaces, unique textures and dramatic colors, inspired by Italy’s top fashion houses and America’s leading designers.



Neenah to Showcase new CLASSIC Papers and more in Booth 2646 at the National Stationery Show


The world’s best stationers and creative makers will soon convene in New York City, May 21-24, at the 2017 National Stationery Show. Neenah will be on hand at Booth 2646 to share its latest paper collections, perfect for letterpress, offset and digital printing. Neenah will also present its world-class packaging solutions including bespoke papers for premium packaging, gift cards, gift card carriers and shopping bags.



Neenah announces another edition to its popular Explore series


Neenah announces another edition to its popular Explore series. The new Explore 5 focuses on the hospitality industry, providing designers with practical, creative ideas to help differentiate their clients with digital print projects. To accompany the Explore 5 portfolio of samples, Neenah offers free downloadable dielines.



Neenah to Showcase new CLASSIC and NEENAH Folding Board Papers at HOW Design Live and THe Dieline Packaging Conference 2017


Neenah is proud to participate again this year at one of the largest annual gatherings of creative professionals in the world. HOW Design Live has become a global happening with nearly 4,0000 attendees expected in Chicago, May 2-6, 2017. The Dieline Packaging Conference runs concurrently.



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